10 March 2004Manufacturing / Production Technology, Hardware & Services
Information Security
As a result of recent environmental concerns regarding the use of lead, the requirements for lead-free semiconductors have been receiving increasing attention within the electronics industry. Current lead-free alternatives have a 30°C higher melting temperature than tin-lead solder, and strongly impact the required peak re-flow temperature (now 260°C vs 225°C for today's tin-lead alloys).
To cope with these new requirements and help its customers to implement a lead-free program, Infineon has released a new package for its MOSFETs in TO220 and TO262/3, which overcomes the well-known limitations faced under heavy stress conditions.
Key features are:
* No bond damage, wire necking, bond lifting, die lifting, delamination after MSL1 at 260°C.
* Green materials - no antimony III oxide, no halogens in the mould compound.
* Improved adhesion between the mould compound and the metallisation due to new inorganic adhesion promoter.
* Improved component and application reliability thanks to enhanced adhesion promoter.
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