Small footprint component placement platform targets large boards
25 February 2004Manufacturing / Production Technology, Hardware & Services
Fire & Safety
Universal Instruments has trimmed the footprint and increased the maximum board size for its high speed placement platform. The result is more flexibility in a smaller shop-floor space. Because the new 4797R HSP accepts up to 96 feeders, these advantages are not achieved at the expense of lower throughput or complicated scheduling, says Universal: placement speed is maintained at 48 000 cph.
The 4797R HSP is capable of handling boards up to 610 mm long by 460 mm wide. Universal has achieved this within a small footprint machine measuring 3100 (l) x 2155 mm deep. As well as maximising throughput and flexibility, the new machine also emphasises placement accuracy. Three-sigma accuracy is 0,08 mm for MELFs and small chips, and 0,05 mm for leaded components.
This is the company's most compact 4797-series HSP machine to feature large board handling capability. It accepts up to 72 unique components on standard 8 mm tape feeders, or 96 unique components with dual-track feeders. As well as 48 000 cph placement, the 4797R HSP has a minimum placement tact time of 0,075 s. Feeder axis tact time is 0,09 s, or 0,08 s with the dual-track feeder.
It can operate as a standalone machine, or grouped with multiple machines for increased flexibility and volume. It is ideal for assembling high volumes of standard products, as well as larger panels such as backplanes for networking or server applications, or PC motherboards.
Additional standard equipment includes 12 5-spindle, advanced direct-drive placement heads, and Universal's UCT53 software for offline programming. Available options include component library data teach, pattern program data teach, Barcode Validation System, traceability package, BGA/CSP recognition, black light PEC camera, and GEM/SECS II.
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