The Series SMC (small multiple connector) miniature connector developed by Erni now offers handling properties for surface-mount soldering.
The connectors have a contact spacing on a 1,27 mm square grid that guarantees optimal space utilisation. In most cases where miniaturisation constitutes a vital step forward in development, assembly then also has to be efficient. The new connector series allows not only conventional dip soldering but also SMD technology. As a result of the development work undertaken a new type of plastic is used - liquid-crystal-polymer (LCP) - a material that improves assembly further.
The new connectors withstand a soldering temperature of up to 285°C. This temperature occurs, for example, in the upper zone of the connector (approx 8-9 mm above PCB level) during infrared soldering. In this temperature range no physical load is permitted - deformed resistance HDT/A 1,82 N/mm2 (DIN 53461 A 250°C).
The connectors have the following properties:
* Operating temperature up to 220°C, short time up to 240°C.
* Inherent non-flammability (UL 94 V-O).
* Very good chemical and oxidation resistance.
* Very high tensile strength and rigidity in the direction of flow.
* High impact resistance.
* Very low thermal expansion coefficient comparable to that of steel and ceramics.
* Very low moisture absorption.
The connectors can be screwed or riveted to the PC board or fastened on to the PCB with plastic pins and potted. With connector contacts manufactured to state-of-the-art contact geometry, the user can achieve good soldering results, particularly if vapour phase soldering is used. Both angled and straight male and female connectors are available with 50 contacts in two rows. The standard version has integrated coding.
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