Realtime CMP wafer polishing pressure mapping

Test & Measurement

7 May 2003 Test & Measurement Access Control & Identity Management News & Events

Sensor Products has introduced Tactilus, a new electronic tactile force and pressure indicating sensor. Tactilus allows an engineer to monitor precisely how force is disbursed between any two contacting surfaces in realtime. According to the company, Tactilus is a valuable aid for R&D and QC/QA in determining proper pressures in wafer polishing as well as in wafer bonding pressure distribution.

"The system will aid in determining precise pressure distribution for not only the actual wafer bonding process," says senior technical manager Jeffrey Stark, "but also for proper polishing head contact pressures. Balancing contact pressures between the bonding head/wafer interface or polishing head/wafer interface during machine set-up can help maximise yields and machine utilisation."

"Tactilus is a Windows-based system that consists of an electronic sensor element 'skin', an interface controller, and software," continues Stark. "The sensor skin is essentially a thin flexible sheet that is densely packed with sensing points or pixels. These sensing points can be spaced as close as 1 mm apart and can collect data as rapidly as 60 000 times per second."

Shown here is a 3D view of a wafer polishing pressure test, revealing inconsistencies in polishing head contact pressure on the right side of the wafer

The Tactilus sensing element is only 10 mils, allowing adaptation over curved surfaces or invasive intolerant environments.

The sensor system is pre-calibrated and requires minimal user training prior to operation. System requirements are Windows 95 (and higher), 16 MB free disk space and 64 MB RAM.

For more information contact Bill Ebner, Sensor Products, 091 973 560 9092, [email protected], www.sensorprod.com/tactilus

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Realtime CMP wafer polishing pressure mapping

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