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Categories
Editor's Choice
Multimedia, Videos
AI & ML
Analogue, Mixed Signal, LSI
Circuit & System Protection
Computer/Embedded Technology
Design Automation
DSP, Micros & Memory
Edge Computing & IIoT
Electronics Technology
Enclosures, Racks, Cabinets & Panel Products
Events
Interconnection
Manufacturing / Production Technology, Hardware & Services
News
Opto-Electronics
Passive Components
Power Electronics / Power Management
Programmable Logic
Smart Home Automation
Switches, Relays & Keypads
Telecoms, Datacoms, Wireless, IoT
Test & Measurement
PDF
e-Book
30 April 2024
EBG — Electronics Buyers' Guide
Featured articles
Analysis of switch-mode power supply: inductor violations
Accelerating the commercialisation of the 5G IoT markets
The ‘magic’ of photovoltaic cells
Hardware architectural options for artificial intelligence systems
Demystifying quantum
Events
EVENTS
News
Analog Devices’ digital storefront is live
From the editor's desk: Exciting times ahead?
Huge SA grid battery project
Invertek produces its three millionth drive
Microchip expands partnership with TSMC
Mouser sponsors NCP Cup 2024
Nordex adding 830 MW of wind generation
SIMCom Symposium 2024
TrinaTracker brings its smart solar tracking to SA
What’s new in Altium Designer
AI & ML
AI-native IoT platform launched
Banana Pi with NPU
ESP32-P4 high-performance MCU
SolidRun unveils new SoM
The UK is building their fastest ever AI supercomputer
World’s most powerful open LLM
xG26 sets new standard in multiprotocol wireless device performance
Circuit & System Protection
Clearing the Static: Understanding the significance of ESD audits
Microchip introduces ECC608 TrustMANAGER
Computer/Embedded Technology
Embedded software development
Microsoft Windows IoT on ARM
DSP, Micros & Memory
8-bit MCU with I3C support
An evolutionary step in customisable logic
Enhanced code protection for USB µC portfolio
General-purpose evaluation board
General-purpose MCU with RISC-V architecture
MCU for battery-powered applications
MIKROE’s IDE now includes MPLAB XC compilers
Qi2 dsPIC33-based reference design
Serial SRAM up to 4 MB
SiP supports LTE/NB-IoT and GNSS
The 8-bit survival syndrome – Part 2
Using AMD HLS to supercharge your design performance
Unlock power efficiency with the new generation of ultra-low-power MCUs
Webinar: The Cyber Resilience Act
Webinar: The future of home security
Interconnection
Analogue, digital and power in one connector
Compact power relays
Digital link 40x faster than broadband Internet
Modular CAT7 inter-car-connection
Multi-channel cable assembly
Manufacturing / Production Technology, Hardware & Services
ITW EAE wins product introduction award
New handle for the XP Series joystick
Next-level conformal coating
The impact of ML in robotics
Passive Components
PCB connectors for power systems
Polymer caps with very high ripple current capability
SPE connector range
TDK expands MLCC series
The role of passives in emerging applications
Updated curve fit equation tool
Updated curve fit equation tool
Power Electronics / Power Management
5 kW switching PSU range
AC-DC brick PSU
Compact PCB-mount SMPS
E-Mobility: navigate safety, interoperability and conformance
Reliable charging range
Schneider Electric partners with Drakenstein Municipality
Webinar: Decarbonise with industrial drives
Zero drift current shunt monitors
Telecoms, Datacoms, Wireless, IoT
4G LTE-M/NB-IoT connectivity reference design
Full sensor to cloud solution
Long-range connectivity module
Long-range Wi-Fi HaLow module
Low phase noise amplifier
Quectel launches 3GPP NTN comms module
SIMCom’s A7673x series
Webinar: Enabling the digital transformation of IIoT with Bluetooth
Wi-Fi 6/BLE module enables rapid development
Webinar: Game-changing Matter standard
Test & Measurement
High-speed AWG generates up to 20 sine waves
Identifying interference in 5G and LTE networks
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