AI & ML

• AI-Inferencing small form factor computer

Analogue, Mixed Signal, LSI

• High-stability digital MEMS gyro

Circuit & System Protection

• ESD control plan evaluation

• LA Series motor protection relay

DSP, Micros & Memory

• Accelerating software-defined vehicles and safety processing
• Industrial smart colour sorter solution with edge intelligence
• MEMS accelerometer with integrated AI
• Microchip expands its secure authentication IC portfolio
• Octal ARINC 429 receiver development kit with SPI host interface

• SoC small enough to be glued to a tooth
• SPI NOR Flash to meet SoCs’ needs
• STLink-V3 modular in-circuit debugger and programmer
• The MPLAB X IDE
• Wireless prototyping with STM32WBA daughter board

Edge Computing & IIoT

• eBook for all IIoT needs

Editor's Choice

• From the editor's desk: Good day from 25 000 feet

Interconnection

• A new space switch for satellite applications
• AcceleRate extreme density and performance systems
• ePower-Lite three-pole connector
• Highly visible, colour-coded labelling
• Low profile BGA mezzanine connector
• Lowest profile push-pull microSD connector

• New evaluation and development kits
• PAM4 and its adoption by PCIe 6.0
• Robust interfaces for inter-car jumpers
• Rugged and reliable connector system
• Ultra-rugged connectors enhance IIoT connectivity
• Waterproof circular power connectors

Opto-Electronics

• Night time landings during load shedding

• Pinpoint detection with the HG-F laser distance sensor

Passive Components

• High-stability oscillator for harsh environments

• Thick film resistors

Power Electronics / Power Management

• 900 V GaN flyback switcher IC
• AEC-Q200 compliant resettable miniature thermal cutoff
• Flyback converter evaluation circuit

• GHA series expands with addition of 700 W
• Test Microchip’s SiC power solutions in design phase
• Three-phase motor control gate driver IC

Smart Home Automation

• Webinar: Industrial solutions with ADLINK I-Pi SMARC development kit

Telecoms, Datacoms, Wireless, IoT

• Advanced connectivity solutions used by Amazon Sidewalk
• Anritsu extends 6G research
• Best-in-class RF GaN solution
• CC200A-LB satellite module for IoT industries
• DC to 55 GHz digital attenuator

• DIGI XBee 3 Global LTE-M/NB-IoT development kit
• MACOM extends PURE CARBIDE GaN-on-SiC power amplifier range to 7kW
• Masterclass: The 5G chip – creating 5G everywhere
• Ultra-low-power bi-directional wireless mesh network modules
• Ultra-small GNSS module with integrated antenna
• UWB technology is poised to take off

Test & Measurement

• Anritsu introduces O-RAN radio unit test solution

• Forced discharge test of lithium batteries for aviation applications
• Solar multifunction tool kit for professionals