Electronics manufacturing webinars
22 June 2011
News
IPC announced a series of webinars for June, July and August 2011. Focused on critical, practical and social issues facing the electronics manufacturing industry, these sessions are based on award-winning technical papers from IPC APEX EXPO 2011. The one-hour webinars offer organisations cost-effective opportunities to bring important new information directly to their conference rooms.
The following webinars will run from 10:00 to 11:00 US Central time (17:00 to 18:00 South African time):
PCB design and assembly process planning for QFN and other bottom termination components
Vern Solberg, STC Madison
Thursday, 23 June
Conflict metals: How this issue will affect your business
Tony Hilvers and Fern Abrams, IPC
Monday, 11 July
A new method measuring conformal coating adhesion
Chris Hunt, Ph. D., National Physical Laboratory (NPL)
Wednesday, 13 July
Cleaning highly dense circuit assemblies and advanced packages
Mike Bixenman, DBA, Kyzen Corporation
Tuesday, 19 July
Printed electronic (PE) circuit process for LED interconnection
Mike Dubois, Caledon Controls
Wednesday, 20 July
A new approach for early detection of PCB cratering failures
Anurag Bansal, Ph.D., Cisco Systems
Wednesday, 27 July
DFM – Design for Manufacturing
Cheryl Tulkoff, DfR Solutions
Wednesday, 3 August
ITAR compliance basics and cyber security for Level 3 manufacturers
Bob Richardson and John Burton, TeamITAR
Tuesday, 9 August
Effects of flux residues on reliability
Eric Bastow, Indium Corporation
Wednesday, 10 August
The registration fee for each webinar is $75 per login for IPC members and $100 per login for non-members. An organisation can stretch its staff development budget by training multiple employees in a conference room, equipped with a speakerphone and projector.
For more information visit www.ipc.org/summer-webinars
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