1 January 2020
Manufacturing / Production Technology, Hardware & Services
Building on the Bergquist brand thermal management portfolio, Henkel has developed a new liquid gap filler material that offers the advantage of thermal interface material (TIM) reworkability, without sacrifices in thermal conductivity or automation performance. TGF 1500RW delivers these benefits in a single material, providing process flexibility and post-assembly adaptability.
The new TIM is a single-part, cure-in-place liquid gap filler that can be used with automated dispensing equipment for high-volume manufacturing. Since the material is applied as a liquid, it is suitable for miniaturised, high-density assemblies and complex architectures, penetrating small gaps for complete coverage. Once cured, the material provides excellent surface contact and thermal transfer with a conductivity of 1,5 W/m-K, and also delivers low- and high-temperature mechanical and chemical stability.
According to the company, the material’s peelability is another advantage. Traditional cure-in-place TIMs usually require high force for disassembly, which can result in permanent damage to components and substrates.
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