Passive Components


Low-profile aluminium electrolytic capacitors

1 January 2020 Passive Components

At 2 and 3 mm thin, Cornell Dubilier’s ULP series offers high energy density in a low-profile aluminium electrolytic capacitor. Designed specifically for applications requiring bulk capacitance and the lowest board profiles, type ULP offers considerably higher energy density than arrays of surface-mount capacitors.

With energy density exceeding 0,4 J/cc, a single ULP capacitor provides much greater bulk storage in a smaller footprint than a bank of low-profile SMT capacitors. Due to its low weight, the ULP is ideal for use in portable devices and is well suited for a wide range of applications where height profile, board space, and weight are critical design factors. In such situations, the ULP is not only cost-competitive, but it also improves circuit reliability through use of a single component versus an entire array of SMT capacitors.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

3,75 GHz RF inductor
RF Design Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.

Read more...
Fast and reliable 4G connectivity worldwide
TRX Electronics DSP, Micros & Memory
Powered by a powerful Quectel LTE Cat 4 modem, the Arduino Pro 4G module’s fast data throughput and high bandwidths ensure reliable and quick data download and upload, even in remote locations.

Read more...
Upgraded power inductor series
iCorp Technologies Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.

Read more...
Advanced high-voltage capacitors
RS South Africa Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.

Read more...
Chip capacitors for high-voltage applications
RS South Africa Passive Components
TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types.

Read more...
Moulded inductors
Future Electronics Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.

Read more...
New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.

Read more...
Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.

Read more...
The future of on-board charging
Future Electronics Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.

Read more...
Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.

Read more...