Manufacturing / Production Technology, Hardware & Services


3D automatic optical solder joint inspector

1 January 2019 Manufacturing / Production Technology, Hardware & Services

The S3088 ultra gold 3D AOI system by Viscom is used successfully for the inspection of components, assemblies and soldered joints around the globe, and has established itself as a premium system with optimal inspection depth and high speed.

The system’s performance is enabled by its innovative camera technology: the high-speed Viscom XMplus camera module produces easy-to-classify height and position values. The access to exact measuring results helps users to create inspection programs. The quality of the data is crucial for accurate, reliable measurement.

The S3088 ultra gold measures multiple height profiles at the solder meniscus with a high resolution of 10 μm. Its laterally angled cameras ensure a panoramic view of components and their solder joints from all eight directions. Realistically accurate inspection images, combined with highly reliable verification software, ensure minimal pseudo-errors.

For more information contact Techmet, +27 11 824 1427, [email protected], www.techmet.co.za



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