New from TDK is an EPCOS DC link capacitor that has been specifically designed for the HybridPACK1-DC6 IGBT module from Infineon Technologies.
Features of this component are its six busbar terminals with dimensions that are matched precisely to fit the IGBT module. This multiple contacting produces excellent current capability while at the same time offering very low parasitics.
For example, the ESR has a maximum value of 0,6 mΩ and the ESL value is just 25 nH. Thanks to this low ESL, voltage peaks on switching off the IGBTs are almost completely eliminated.
The new capacitor with the order number B25655P4607J021 is designed for a rated voltage of 450 V d.c. and offers a capacitance of 600 μF. Its current capability is about 150 A at a maximum ambient temperature of 105°C and a cooled temperature on the underside of 75°C. The component is designed using power capacitor chip (PCC) technology in which the capacitor element is constructed as a stacked winding, with which a volume fill factor of nearly 1 is achieved. The dimensions of the housing are correspondingly compact, at just 140 x 72 x 50 mm.
Furthermore, a flat winding version is offered in the same housing (B25655P4477J121). This type has a capacitance of 470 μF and is likewise designed for 450 V d.c. At a maximum ambient temperature of 105°C and a cooled temperature on the underside of 75°C, its current capability is about 150 A. The ESR value of this design is 0,8 mΩ and the ESL value is 25 nH.
Apart from the standard version, the capacitor is also available with an additional connection for the EPCOS high-voltage DC EMC filter. All in all, the combination of the IGBT module with the new link circuit capacitor enables the design of extremely compact inverters for xEV applications or for use as industrial inverters.
3,75 GHz RF inductor RF Design
Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.
Read more...Upgraded power inductor series iCorp Technologies
Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.
Read more...Advanced high-voltage capacitors RS South Africa
Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.
Read more...Moulded inductors Future Electronics
Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
Read more...New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.
Read more...Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.
Read more...The future of on-board charging Future Electronics
Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.
Read more...Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.
Read more...First 100 µF MLCC in 0603 packaging RS South Africa
Passive Components
Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.
printer friendly version