Computer on module for rugged applications

15 June 2016 Computer/Embedded Technology

Concurrent Technologies announced a new processor XMC module based on a low-power variant of the 6th generation Intel Core family previously known as Skylake-H.

Processor XMCs are a form of computer on module with a defined conduction-cooled envelope suitable for use on both custom and open standard based carriers, including VPX and VME. The new module – XP B5x/msd – is intended for use in long lifecycle applications within the industrial, scientific, defence and aerospace markets, including environments needing rugged solutions.

XP B5x/msd initially features the 2-core Intel Core i3-6102E processor with 8 GB of DDR4 ECC DRAM to provide good performance with low power consumption. It includes an onboard 64 GB solid state disk which can accommodate an operating system, application code and data storage.

Main connectivity to the baseboard is provided by a single x8 or dual x4 PCI Express (PCIe) lane configuration for high-bandwidth connectivity. A range of standard I/O interfaces including Ethernet, USB, SATA, RS-232, digital I/O and DisplayPort are included to satisfy a variety of configurations.

Air-cooled XP B5x/msd modules are available for immediate shipment and rugged conduction-cooled variants will follow later this year.

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