NXP Semiconductors’ new software developmentkit (SDK) for Kinetis microcontrollers (MCUs) offers support for home automation applications using Apple HomeKit technology. Leveraging the performance and Bluetooth Smart connectivity of NXP’s Kinetis products, the solution streamlines development for a wide range of HomeKit compatible products.
HomeKit is a framework in iOS that lets accessories connect seamlessly so people can better manage their homes. It offers a set of common protocols which enable accessories to work together easily and securely, and allows consumers to control them simply using Siri. HomeKit is built on a secure foundation with end-to-end encryption, providing customers a secure connection between their iPhone, iPad or iPod touch and HomeKit-enabled accessories.
HomeKit software from NXP works with Kinetis K MCUs such as the K11, K22, K24 and K26, while Kinetis KW40Z or KW30Z wireless MCUs provide Bluetooth Smart functionality. Based on the ARM Cortex-M4 core, Kinetis K series MCUs incorporate an arsenal of security features such as cryptographic keys storage, software and system protection options, a hardware random number generator (RNG), and integrated system tamper detection.
The first product based on NXP Kinetis technology with HomeKit support is the Schlage Sense Smart Deadbolt from Allegion, already available in retail stores including the Apple Store. Schlage’s solution is designed to let users control door locks using an iPhone, iPad or iPod touch, as well as manage and store multiple access codes and share electronic access.
Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
Read more...UFS Flash named Best in Show EBV Electrolink
News
KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.
Read more...The power of UWB EBV Electrolink
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.
Read more...Trimension family secures car access EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.
Read more...Altium provides free training
Design Automation
There is no longer any excuse not to master Altium Designer with the company now offering both advanced instructor-led three-day training and an on-demand video series.
Read more...Entry-level MCU with classical peripherals EBV Electrolink
DSP, Micros & Memory
NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.
Read more...Altium syncs your design and PCB programming software EDA Technologies
Design Automation
Altium Designer and Altium 365 can keep track of everything needed in PCB design, PCB programming language, component sourcing, and much more, as an embedded application is developed.
Read more...QLC Flash memory with the latest BiCS technology EBV Electrolink
Analogue, Mixed Signal, LSI
KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps.
printer friendly version