Manufacturing / Production Technology, Hardware & Services


Halogen-free solder paste

27 January 2016 Manufacturing / Production Technology, Hardware & Services

Indium8.9HF is an air-reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg and other alloy systems favoured by the electronics industry to replace conventional lead-bearing solders. It has robust reflow properties in both nitrogen and air, and it passes J-STD-004B, the most stringent version requirement for a halogen-free solder paste, with excellent SIR results.

Indium8.9HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. By recovering quickly from a pause, it allows customers to maximise time between wipes while maintaining a long stencil life. The paste is resistant to common defects known as head-in-pillow and graping, and is well suited for the automotive industry. In addition, its high probe testability minimises false failures in in-circuit testing.

For more information contact Techmet, +27 (0)11 824 1427, [email protected], www.techmet.co.za



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