Ultrasonic solder nozzle cleaner

12 August 2015 Manufacturing / Production Technology, Hardware & Services

Soiled solder nozzles can significantly affect reproducibility in selective soldering processes.

This can be avoided with a new and innovative feature from Seho Systems: a patented, automated ultrasonic cleaning technology for wetted miniwave solder nozzles.

What previously had to be done manually and with aggressive chemicals, can be performed automatically and in an environmentally friendly manner with the new machine. With the ultrasonic cleaning unit, the liquid solder is set into oscillation which thereby gently cleans the surface of the nozzle. Using the existing inert atmosphere, the surface is completely re-wetted and the solder nozzle is restored to its original state.

Besides a markedly longer lifetime of the solder nozzles, these features provide for a highly stable process and significant time savings.

For more information contact Igmar Grewar, Quamba Technologies, +27 (0)83 417 4294, [email protected], www.quamba.co.za

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