Samtec’s newly released Z-Ray one-piece arrays are ultra-low-profile, high-density and highly customisable. These compression contact arrays are used as interposers or integrated into connector housings.
They feature X-Y-Z axis flexibility, customisable shapes and patterns, extended cycle life, low normal force with high deflection range and 28+ Gbps performance.
These 0,80 mm pitch arrays (ZA8 series) are available with a choice of dual compression contacts or single compression with solder balls. With up to 400 total BeCu micro-formed contacts, they feature low 25 G normal force with 0,20 mm contact deflection.
Z-Ray is a one-piece design assembled into rugged, single-layer FR4 substrate under high pressure and temperature to achieve a 1,00 mm stack height. Screw-down and alignment holes are standard for use with press fit alignment hardware for a secure connection without over-compression between the PCB boards. A #34 AWG twinax cable on 0,80 mm pitch with 8 and 16 pairs standard is in development.
A variety of custom capabilities are available, including the overall shape of the interposer, multiple pitches as low as 0,65 mm, greater density of up to 1200 contacts per square inch in any pattern, and stack heights from 0,50 mm to 4 mm. Construction of the interposer is customisable with multi-layer FR4, for example pitch spreaders and other embedded interconnect circuitry.
Design flexibility also includes features such as latches, thermal spreaders and quick-release spring constraints for more rugged applications. Quick-turn customisations are available and require minimal NRE and tooling charges.
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