Microchip’s latest 2,4 GHz RF high-power amplifier, the SST12CP12, adds support for 256-QAM ultra-high data rate modulation. With its high linear output power of up to 23 dBm at a dynamic EVM as low as 1,8% and MCS8 40 MHz bandwidth modulation, as well as 25 dBm linear power at 3% EVM, this device extends the range of IEEE 802.11b/g/n WLAN systems while providing high power at the maximum 256-QAM data rate. It is also spectrum mask compliant up to 28,5 dBm for 802.11b/g communication, and uses orthogonal frequency-division multiplexing (OFDM) to correct severe channel conditions without the need for complex equalisation filters. The chip reduces board space with its small 3 x 3 x 0,55 mm, 16-pin QFN package.
A new era in modular I/O solutions Rugged Interconnect Technologies
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Aerospace and defence system designers are demanding scalable and high-performance I/O solutions and while traditional mezzanine standards have proven reliable, they often fall short of meeting modern bandwidth, size, and flexibility requirements.
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