20 February 2013Manufacturing / Production Technology, Hardware & Services
Martin’s Mini-Oven 04 Reball/Prebump unit is ideal for the complete QFN solder bumping process, even for the smallest pitches. Using unique Hotprint technology, the mask is not removed after printing paste, but remains on the QFN during reflow.
The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs, and can be completed in as little as three minutes. The simple soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone.
The unit offers programmable modes and a nitrogen process gas supply. Up to 99 profiles can be accommodated, with the ability to edit individual profiles and fine tune parameters.
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