Reflow fundamentals webinar

25 November 2020 Events

Indium Corporation’s Kim Flanagan, technical support engineer, will host an Insider Series webinar on reflow fundamentals in two sessions on Wednesday, 10 February and Tuesday, 16 February, both at 4 pm South African time.

Soldering defects in SMT can arise from three main areas: design, materials, and process. Identifying the root cause and troubleshooting defects can be time consuming and expensive. There can be many ways to resolve one solder issue and, oftentimes, the easiest and least expensive way to resolve one of these soldering defects is by adjusting the reflow process. However, in order to understand how to best optimise the reflow profile, it is crucial to understand the basics behind the solder materials.

During the two sessions of ‘Reflow 101 from a Solder Manufacturer’s Perspective’, presenter Kim Flanagan will explain the materials science basics behind solder pastes, and how this knowledge can be used to optimise the reflow profile in order to resolve some common solder defects.

Indium’s Insider Series is a free programme designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at www.indium.com/webinar.

To register for Flanagan’s webinar, visit the link above. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.

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