The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
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The vision of industry pioneers Hugo de Bruyn and Charles Hauman led to the birth of Deman Manufacturing, a company that sets new standards for innovation and performance within the industry.
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Arrow Electronics, represented by Altron Arrow in South Africa, and its engineering services company, eInfochips, are working with Infineon Technologies to help eInfochip’s customers accelerate the development of EV chargers.
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Newelec’s Motor Protection Relay front-end software isn’t just another tool, it’s a game changer that puts control firmly in your hands.
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New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
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Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
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Teraco has announced that it has secured its first grid capacity allocation from Eskom, and will commence construction of a 120 MW utility-scale solar PV energy facility in the Free State province.
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The Semiconductor Industry Alliance (SIA) has announced global semiconductor sales totalled $47,6 billion during the month of January, an increase of 15,2% compared to January 2023.
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SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
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As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.
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Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.
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The STM32WL5M from ST Microelectronics is the company’s first LoRaWAN-certified module which incorporates two cores, one of them being a wireless stack to optimise the creation of sub-GHz applications.
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The Quectel RG255G offers downlink performance of 220 Mbps, and uplink performance of 121 Mbps on 256QAM or 91 Mbps on 64QAM.
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Duxbury Networking has announced the South African availability of the Nextivity CEL-FI GO G43 multi-operator cellular coverage solution, that ensures customers and employees have reliable mobile coverage.
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A recent announcement by STMicroelectronics has revealed an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with 2,3k resolution.
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Infineon’s CYPD7272-68LQXQ is the tray packing option of the company’s dual-port USB-C power delivery solution and features an integrated dual-port USB-C PD + DC-DC controller.
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The units from Meanwell can either be supplied with a three-phase three-wire delta input of 196 to 305 V AC, or they can use a three-phase four-wire star connection of 340 to 530 V AC.
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The LIR40-40 is a wide input range DC-DC module, with a constant output of 48 V at a nominal output current of up to 40 A.
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