Passive Components


Voltage divider resistors

21 July 2010 Passive Components

Vishay has expanded its offering of Bulk Metal Foil and Z-Foil high-precision voltage divider resistors with the release of eight new and enhanced devices, including the new high-power VFD244/Z and conformally coated VSH144/Z, and the enhanced 300144/5 and 300144Z/5Z.

All new Foil devices offer a low typical TCR of ±2 ppm/°C from -55°C to +125°C, +25°C ref., while the Z-Foil devices feature TCR of ±0,05 ppm/°C typical from 0°C to + 60°C and ±0,2 ppm/°C typical from -55°C to +125°C, +25°C ref. The Z-Foil resistors provide PCR tracking (R due to self-heating) of ±5 ppm at rated power. The devices’ low TCR is combined with tight tolerances and high load-life stability values for precision instrumentation amplifiers, bridge networks and differential amplifiers in high-end medical, military, aerospace, automatic test and down-hole drilling equipment.

The new VFD244 and VFD244Z offer a high power rating up to 1 W at +70°C, divided proportionally between the two elements, over a working voltage of 350 V. The VFD244 features TCR tracking of 0,5 ppm/°C, while the VFD244Z provides tracking down to 0,1 ppm/°C. Both devices offer tolerance matching to ±0,005%, a load-life stability ratio of <0,005% at +70°C for 2000 hours at rated power, and a resistance range from 1 Ω to 150 kΩ.

The conformally coated VSH144 and VSH144Z feature tolerance matching to ±0,01 %, a load-life stability ratio of <0,01% at +70°C for 2000 hours at rated power, and a resistance range from 100 Ω to 20 kΩ. The VSH144 offers TCR tracking to 0,5 ppm/°C, while the VSH144Z provides tracking down to


0,1 ppm/°C. Both devices feature a power rating of 0,2 W at 70°C, divided proportionally between the two elements, over a maximum working voltage of 200 V.

The enhanced 300144/5 and 300144Z/5Z offer TCR tracking to 0,5 ppm/°C and 0,1 ppm/°C, respectively. Both Foil and Z-Foil devices provide tolerance matching to ±0,005 %, a load-life stability ratio of <0,005% at +70°C for 2000 hours at rated power, and a resistance range from 100 Ω to 20 kΩ. The devices offer a power rating of 0,2 W at 70°C, divided proportionally between the two elements, over a maximum working voltage of 200 V. The 300145/Z provides a pair of 300144/Z elements back to back in a single moulded package.

All the new divider resistors offer a low voltage coefficient of <0,1 ppm/V, current noise of <-40 dB, and thermal EMF of 0,05 μV/°C typical. The resistors provide a 1 ns rise time (effectively without ringing), and a non-inductive (<0,08 μH), non-capacitive design. The devices are available with standard tin/lead or lead-free terminations and can withstand electrostatic discharges up to 25 kV.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, marian.ledgerwood@futureelectronics.com, www.futureelectronics.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Rapid IoT prototyping simplified
Future Electronics Test & Measurement
The STEVAL-MKBOXPRO from STMicroelectronics is a compact, ready-to-use wireless development kit designed to accelerate the creation of intelligent IoT and wearable applications.

Read more...
High-precision thick-film resistors
Avnet Silica Passive Components
The new Panasonic ERJPC high precision thick-film resistors series deliver accuracy levels previously only achievable with thin film technology, offering customers higher power density and cost-effective performance.

Read more...
Semi-shielded power inductors
RS South Africa Passive Components
The SDCx family from Eaton includes the SDCL and SDCH series of semi-shielded power inductors designed for reliable performance in consumer, industrial, energy, and medical applications.

Read more...
Cortex-M33 performance for cost-sensitive designs
Future Electronics DSP, Micros & Memory
The STM32C5 series from STMicroelectronics introduces a new generation of entry-level microcontrollers engineered to deliver enhanced processing capability, modern security, and cost-effective scalability for connected embedded applications.

Read more...
Next generation HMI processing platform
Future Electronics DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.

Read more...
Compact high-current power inductor
EBV Electrolink Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.

Read more...
Tiny noise suppression filters
RS South Africa Passive Components
TDK Corporation recently announced its latest noise suppression filters of the MAF0603GWY series, which measure only 0,6 x 0,3 x 0,3 mm.

Read more...
Compact 1250 V choke solution
Electrocomp Passive Components
TDK Corporation has introduced a new high-voltage common-mode choke series designed to support more compact and efficient 1250 V DC converter architectures in next-generation power electronics.

Read more...
MIL-spec connector series
Future Electronics Interconnection
The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems.

Read more...
Next-generation HMI and vision processing
Future Electronics Edge Computing & IIoT
The Renesas RA8D2 group of microcontrollers delivers ultra-high performance for next-generation graphics, HMI, and vision-driven designs that demand fast response, rich visual interfaces, and embedded AI capability.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved