Bergquist has extended its family of S-class low-modulus gap pad materials optimised for high thermal performance by introducing Gap Pad 1500S30, which achieves thermal conductivity of 1,3 W/m-K and bulk-hardness rating of 30 (Shore 00). The new formulation increases choices for designers seeking efficient heat removal from fragile components in cost-sensitive applications.

The low-pressure conformability and wet-out characteristic of Gap Pad 1500S30 excludes interfacial air even when surfaces have high roughness or uneven topography. In addition, the high conformability also reduces stress on component leads and prevents bowing of circuit boards, as well as providing low-stress vibration damping and shock absorption. Like other S-class materials, the material also has inherent tack on both sides, which saves applying adhesive and promotes easy handling during assembly. The silicone-based material also includes fibreglass reinforcing for high resistance to puncture, tearing or shearing.

Gap Pad 1500S30 is available in sheet form or as die-cut parts from 0,508 mm to 3,175 mm thick. The continuous operating temperature range of -60°C to 200°C allows use in applications such as heat-pipe assemblies, hard disk drives, power supplies and memory modules. The material can be inserted between a heatsink and any type of heat-generating semiconductor such as a memory IC, power transistor, module or signal-path components.

For more information visit www.bergquistcompany.com