New revision for BGA assembly standard
14 May 2008
News
The IPC has announced the release of IPC-7095B, Design and Assembly Process Implementation for BGAs.
Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents unique challenges for design, assembly, inspection and repair personnel, especially in light of recent changes in alloys and surface finishes. IPC-7095B offers practical information to anyone currently using BGAs or considering a conversion to area array packaging formats.
"The B revision of IPC-7095 was released at APEX in Vegas with 100% approval of voting members, which is an extraordinary achievement and a great tribute to the hard work of the committee," says Ray Prasad, principal of Ray Prasad Consultancy Group and committee chair.
"This version focuses on the design and assembly issues of lead-free BGAs along with applications that use both tin-lead and lead-free on the same board, including various solder ball alloys, new laminate materials for lead-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost," adds Prasad. "There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability."
For more information visit www.ipc.org
Further reading:
Seven Labs partnership enhances local electronics distribution
Seven Labs Technology
News
Aimed at revolutionising the electronics distribution landscape in South Africa, Seven Labs has announced a partnership with LCSC, one of China’s most reputable electronics distributors.
Read more...
From the editor's desk: How electronics is shaping modern warfare
Technews Publishing
News
From radar systems and encrypted communications to drones and cyber warfare, electronic devices have transformed the battlefield into a highly digitised and networked environment.
Read more...
Global semiconductor sales increase 18,7% YoY
News
The Semiconductor Industry Association (SIA) announced that global semiconductor industry sales hit $51,3 billion during the month of July 2024, an increase of 18,7%.
Read more...
Renesas completes acquisition of Altium
News
Altium is now a wholly owned subsidiary of Renesas, with Altium CEO Aram Mirkazemi assuming the role of senior vice president and head of Renesas’ Software & Digitalization.
Read more...
Altron Arrow joins forces with Identiv
Altron Arrow
News
The strategic collaboration with Altron Arrow expands Identiv’s reach in the southern African market.
Read more...
The rise of AI expertise as a new employment trend in South Africa
Editor's Choice News
As artificial intelligence (AI) technology continues to evolve globally, its integration into the South African business landscape is becoming increasingly prominent, and this shift has triggered a surge in demand for AI specialists.
Read more...
SSD-based RAID offload tech named ‘Best of Show’
News
KIOXIA Europe GmbH announced that its RAID Offload on SSD technology received an FMS ‘Best of Show’ award in the ‘Most Innovative Technology’ SSD technology category.
Read more...
Robotic dog monitors manufacturing facility
News
Named Rover, the Boston Dynamics-built robot dog helps engineers save time, while also enhancing safety in the facility.
Read more...
Bluetooth Channel Sounding provides sub-metre accuracy
Altron Arrow
News
Bluetooth Channel Sounding is a new protocol stack designed to enable secure and precise distance measurement between two Bluetooth LE connected devices.
Read more...
Workshop: Product development and industrialisation
News
SKEG is excited to join forces with The Lion Cage to present a workshop on the intricacies of product development and industrialisation to assist in guiding innovative ventures to scale.
Read more...