DSP, Micros & Memory


Creating a serial peripheral interface for communications between microprocessors and peripherals

7 November 2001 DSP, Micros & Memory

This article describes how to implement communications between microprocessors and peripherals using the Xilinx CoolRunner XPLA3 CPLDs. The CoolRunner implementation of a serial peripheral interface (SPI) master described here can be used to add an SPI controller to microprocessors or microcontrollers that do not provide this interface.

Serial peripheral interface protocol

SPI is a full-duplex, synchronous, serial data link. A single SPI device is configured as a master; all other SPI devices on the SPI bus are configured as slaves. The SPI bus consists of four wires:

* Serial Clock (SCK) - Driven by the SPI master and regulates the flow of data bits. The SPI specification allows a selection of clock polarity and a choice of two fundamentally different clocking protocols on an 8 bit oriented data transfer.

* Master Out Slave In (MOSI) - Data output from the SPI Master and input to the SPI Slaves.

* Master In Slave Out (MISO) - Data input to the SPI Master and output from the selected SPI Slave. Only one selected slave device can drive data out from its MISO pin.

* Slave Select (SS) - Selects a particular slave via hardware control. Slave devices that are not selected do not interfere with SPI bus activities. The SS control line can be used as an input to the SPI master indicating a multiple-master bus contention (SS_IN). If the SS signal to the master is asserted, it indicates that some other device on the bus is attempting to be a master and address this device as a slave. Assertion of SS automatically disables SPI output drivers in the master device if more than one device attempts to become master.

The SCK, MOSI, and MISO pins of all SPI devices on the SPI bus are connected together in parallel.

Master implementation

This SPI master design supports the following features:

* Microcontroller interface.

* Multimaster bus contention detection and interrupt.

* Eight external slave selects.

* Four transfer protocols available with selectable clock polarity and clock phase.

* SPI transfer complete interrupt.

* Four different bit rates available for SCK.

A high-level block diagram is shown in Figure 1. The microcontroller (µC) interface is a VHDL module that one can easily modify to support other micro-controllers. The address decode/bus Interface logic interprets the bus cycles of the microcontroller and performs the read/write operations to the register file. The register file is the interface between the µC and the SPI master logic, and allows the µC to configure and control the operation of the SPI master.

Status of the current transfer is provided to the µC via a status register in the register file. Registers are also included to contain the µC data to be transmitted on the SPI bus and data received from the SPI bus. The SPI control state machine controls the shifting and loading of SPI data in the SPI shift registers, and the generation of the slave select signals. The SCK clock logic generates an internal SCK based on the settings in the control register for clock phase, division, and polarity.

Figure 1. CoolRunner SPI master
Figure 1. CoolRunner SPI master

Conclusion

CoolRunner CPLDs operate at the lowest standby power (<100 µA) of any CPLD available today, and they are an ideal programmable logic solution for providing interface controllers in portable or power sensitive applications. See www.xilinx.com/apps/epld.htm#CoolRunner for an SPI reference design and detailed application note (XAPP348), VHDL source code, and VHDL testbenches.

For further information contact Avnet Kopp, (011) 444 2333, [email protected] or www.avnet.co.za





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

High reliability memories
Altron Arrow DSP, Micros & Memory
Infineon’s mil-temp memories offer a wide selection of volatile and non-volatile memories for applications that meet QML-Q certifications and offer support for mil-aero applications.

Read more...
KIOXIA pioneer new 3D Flash technology
EBV Electrolink DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

Read more...
Artificial intelligence meets embedded development
Avnet Silica DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.

Read more...
Embedded module for AI vision applications
Rugged Interconnect Technologies DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.

Read more...
High-speed Flash for SoC applications
NuVision Electronics DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.

Read more...
Super-fast H.264 encoder FPGA core
EBV Electrolink DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.

Read more...
ST MCUs extend ultra-low power innovation
Altron Arrow DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.

Read more...
Chipset enables ultra-wide signal capture
RFiber Solutions DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

Read more...
SoC for real-time AI at the edge
Future Electronics DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.

Read more...
Evaluation kit for ML applications
Future Electronics DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.

Read more...